Chip DECAP Analysis

KnowHow-Tech technical team members provide device model analysis services to customers, from the chip and device on the short model code to analyze the complete chip model.

In addition, in view of the absence of the chip completely, by analysis of chip chip open way, the industry also known as "chip kaifeng", English for decapsulation, namely "DECAP. The KnowHow-Tech technical team members are using it in two main ways:

1. Fix the chip requiring model analysis on a specific binding table, and use a special solution and tool to completely dissolve and remove the IC outer package, exposing its internal model and metal wire. This method is more direct and thorough, but the efficiency is low, and easy to damage the chip model, at present most cases use the second way.

2. Removing only the necessary packaging on the surface of the silicon core, the KnowHow-Tech technical team members, with their expertise and experience, use a specific acid solution to etch the epoxy around the chip and then dissolve the chip packaging without affecting the chip or the wiring. The process is usually performed under very dry conditions. The next step is to clean the chip in an ultrasonic tank to remove the acid.